Simcenter Flotherm XT for Electronics Cooling Design
Fast electronics thermal design by connecting MCAD and ECAD
Simcenter Flotherm XT is an advanced computational fluid dynamics (CFD) tool specifically designed for electronics cooling applications. By bridging the gap between ECAD (electronic CAD) and MCAD (mechanical CAD) workflows, it enables thermal engineers to address heat management challenges earlier in the product development cycle—enhancing both efficiency and accuracy.
Accelerate Thermal Design Cycles
Simcenter Flotherm XT helps compress the electronics thermal design process significantly. By integrating thermal analysis directly with mechanical and electrical design processes, engineers can cut simulation and analysis time by at least 50% compared to conventional general-purpose CFD tools. This streamlined approach allows for faster iteration and validation of thermal performance.
Seamless ECAD Integration
With its powerful EDA Bridge, Simcenter Flotherm XT makes it easy to import and modify complex electronic design data, including printed circuit board (PCB) layouts and component placements. Users can adjust model attributes such as size, position, shape, and orientation with ease. Supporting industry-standard file formats like ODB++, the software enables quick, reliable data transfer from leading EDA tools, minimizing manual translation and the potential for errors.
Intuitive CAD-Centric Interface
Designed with a CAD-focused interface, Simcenter Flotherm XT allows users to work with complex and irregular geometries found in modern electronics. The tool offers native compatibility with major CAD formats and supports direct editing, making it easier to adapt and modify geometry during the design phase. Built-in SmartParts and component libraries simplify model creation, further accelerating workflow.
Design Optimization and Parametric Analysis
Engineers can carry out parametric studies and thermal optimization directly within the integrated environment. By varying geometric features, material properties, or simulation settings, users can explore multiple design scenarios. The tool also supports Design of Experiments (DoE) to efficiently investigate performance trade-offs and identify the optimal design configurations.
A robust EDA data import process is coupled with modeling fidelity options for PCB thermal modeling including copper trace joule heating. Engineers designing electronics thermal management solutions featuring heatsinks, fans, TECs, or liquid cooling can eliminate typical overheads in model creation and utilize parametric studies to optimize designs faster.
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